Patent Assignment
Reel/Frame 050219/0297
Assignment of Assignor's Interest
Recorded: 2019-08-30
Pages: 12
Assignors
WANG, KE
Executed: 2019-03-18
LU, XINHONG
Executed: 2019-03-18
HU, HEHE
Executed: 2019-03-18
YANG, WEI
Executed: 2019-03-18
NING, CE
Executed: 2019-03-18
Assignee
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Array Substrate and Manufacturing Method Thereof, and Dislay Device