Patent Assignment
Reel/Frame 050248/0775
Assignment of Assignor's Interest
Recorded: 2019-09-03
Pages: 4
Assignors
LEE, SHAO-KUAN
Executed: 2019-08-13
CHEN, HAI-CHING
Executed: 2019-08-13
HUANG, HSIN-YEN
Executed: 2019-08-13
SHUE, SHAU-LIN
Executed: 2019-08-13
LEE, CHENG-CHIN
Executed: 2019-08-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Comprising Etch Stop Layer Over Dielectric Layer and Method of Manufacture