Patent Assignment
Reel/Frame 050266/0173
Assignment of Assignor's Interest
Recorded: 2019-09-04
Pages: 3
Assignors
LIANTO, PRAYUDI
Executed: 2019-08-26
HUNG, SHIH CHAO
Executed: 2019-08-26
TOH, GEOK SAN
Executed: 2019-08-28
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Methods and Apparatus for Determining Endpoints for Chemical Mechanical Planarization in Wafer-Level Packaging Applications
Application:
16/545,997 →
Publication:
US 2021/0057292
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.