Patent Assignment
Reel/Frame 050270/0456
Assignment of Assignor's Interest
Recorded: 2019-09-05
Pages: 4
Assignors
LU, CHUNG-YU
Executed: 2019-08-20
HUANG, PING-KANG
Executed: 2019-08-23
CHIU, SAO-LING
Executed: 2019-08-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Board Substrates, Three-Dimensional Integrated Circuit Structures and Methods of Forming the Same