Patent Assignment
Reel/Frame 050278/0818
Assignment of Assignor's Interest
Recorded: 2019-09-05
Pages: 5
Assignor
KO, YOUNG GWAN
Executed: 2019-08-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Backside Redistribution Layer