Patent Assignment
Reel/Frame 050290/0759
Assignment of Assignor's Interest
Recorded: 2019-09-06
Pages: 19
Assignors
YATSUDA, KOICHI
Executed: 2019-08-27
HAYAKAWA, TAKASHI
Executed: 2019-09-05
IWASHITA, MITSUAKI
Executed: 2019-08-29
TANAKA, TAKASHI
Executed: 2019-08-27
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method for Manufacturing a Contact Pad, Method for Manufacturing a Semiconductor Device Using Same, and Semiconductor Device