Patent Assignment
Reel/Frame 050291/0191
Assignment of Assignor's Interest
Recorded: 2019-09-06
Pages: 5
Assignors
KATAGI, HIDEYUKI
Executed: 2019-08-01
MARUYAMA, NAOKI
Executed: 2019-08-05
YOSHIDA, YUKA
Executed: 2019-08-09
HIGASHIUCHI, TOMOKO
Executed: 2019-08-05
TAKEZAWA, YOSHITAKA
Executed: 2019-08-05
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Polymer, Epoxy Resin, Epoxy Resin Composition, Resin Sheet, B-Stage Sheet, Cured Product, C-Stage Sheet, Metal Foil with Resin, Metal Substrate and Method for Manufacturing Epoxy Resin
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 5, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061606/0491 →
Change of Name
Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Corrective Assignment to Correct the the Address of the Assignee Previously Recorded at Reel: 06236 Frame: 0323. Assignor(S) Hereby Confirms the Assignment.
Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →