Patent Assignment
Reel/Frame 061606/0491
Change of Name
Recorded: 2022-10-05
Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
1-9-2, MARUNOUCHI, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Epoxy Polymer, Epoxy Resin, Epoxy Resin Composition, Resin Sheet, B-Stage Sheet, Cured Product, C-Stage Sheet, Metal Foil with Resin, Metal Substrate and Method for Manufacturing Epoxy Resin
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 6, 2019
From: KATAGI, HIDEYUKI; MARUYAMA, NAOKI; YOSHIDA, YUKA; HIGASHIUCHI, TOMOKO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050291/0191 →
Change of Name
Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Corrective Assignment to Correct the the Address of the Assignee Previously Recorded at Reel: 06236 Frame: 0323. Assignor(S) Hereby Confirms the Assignment.
Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →