Patent Assignment
Reel/Frame 050291/0486
Assignment of Assignor's Interest
Recorded: 2019-09-06
Pages: 4
Assignee
MITSUBISHI MATERIALS CORPORATION
2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, 1008117, JAPAN
Covered Property
(1)
Power-Module Substrate with Heat-Sink