Patent Assignment
Reel/Frame 050296/0573
Assignment of Assignor's Interest
Recorded: 2019-09-06
Pages: 6
Assignors
KAMPHUIS, ANTONIUS HENDRIKUS JOZEF
Executed: 2019-09-04
DE GRAAUW, ANTONIUS JOHANNES MATHEUS
Executed: 2019-09-04
BUIJSMAN, ADRIANUS
Executed: 2019-09-06
VINCENT, MICHAEL B.
Executed: 2019-09-03
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, NL-5656 AG, NETHERLANDS
Covered Property
(1)
A Semiconductor Device Package Comprising an Encapsulated and Conductively Shielded Semiconductor Device Die That Provides an Antenna Feed to a Waveguide