Patent Assignment
Reel/Frame 050303/0919
Assignment of Assignor's Interest
Recorded: 2019-09-09
Pages: 4
Assignors
SUNG, YUN-HSING
Executed: 2019-08-30
KAO, CHUN-YU
Executed: 2019-08-30
WU, ZONG XIAN
Executed: 2019-08-30
Assignee
CO-TECH DEVELOPMENT CORP.
8F., NO. 392, RUEY KUANG ROAD, NEIHU DIST.,, TAIPEI CITY, TAIWAN
Covered Property
(1)
Micro-Roughened Electrodeposited Copper Foil and Copper Foil Substrate