Patent Assignment
Reel/Frame 050315/0031
Assignment of Assignor's Interest
Recorded: 2019-09-09
Pages: 6
Assignors
MANISCALCO, JOSEPH F.
Executed: 2018-07-09
MOTOYAMA, KOICHI
Executed: 2018-07-09
KELLY, JAMES J.
Executed: 2018-07-09
SHOBHA, HOSADURGA
Executed: 2018-07-09
YANG, CHIH-CHAO
Executed: 2018-07-09
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Void-Free Metallic Interconnect Structures with Self-Formed Diffusion Barrier Layers