Patent Assignment
Reel/Frame 050316/0029
Assignment of Assignor's Interest
Recorded: 2019-09-09
Pages: 2
Assignors
LEE, SEUNG JIN
Executed: 2019-09-05
YOON, HYUNG KYU
Executed: 2019-09-05
JUNG, HYE YEONG
Executed: 2019-09-05
Assignee
LG INNOTEK CO., LTD.
98, HUAM-RO, JUNG-GU, SEOUL, 04637, KOREA, REPUBLIC OF
Covered Property
(1)
Flexible Circuit Board, Chip Package Including the Same, and Electronic Device Including the Chip Package