Patent Assignment
Reel/Frame 050316/0619
Assignment of Assignor's Interest
Recorded: 2019-09-09
Pages: 3
Assignee
FAIRCHILD KOREA SEMICONDUCTOR LTD.
55, PYEONGCHEON-RO 850 BEON-GIL, WONMI-GU, GYEONGGI-DO, BUCHEON, 14487, KOREA, REPUBLIC OF
Covered Property
(1)
Vertically Stacked Multichip Modules
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 9, 2019
From: FAIRCHILD KOREA SEMICONDUCTOR LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 050317/0353 →
Security Interest
Nov 26, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051145/0062 →
Corrective Assignment to Correct the Exclusion of Fairchild Semiconductor Corporation of Conveying Party Previously Recorded on Reel 051145 Frame 0062. Assignor(S) Hereby Confirms the Security Interest.
Dec 3, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051170/0781 →
Release of Security Interest in Patents Recorded at Reel 051145, Frame 0062
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0474 →