Patent Assignment
Reel/Frame 050317/0088
Assignment of Assignor's Interest
Recorded: 2019-09-09
Pages: 8
Assignors
CHO, BYUNG YUN
Executed: 2019-05-30
JIN, SU IL
Executed: 2019-05-30
OH, YOUNG KEUN
Executed: 2019-05-30
YIM, KWAN BIN
Executed: 2019-05-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Power Management Integrated Circuit Chips, Solid-State Drives Including the Same, and Solid-State Drive Power-Mode Control Methods