Patent Assignment
Reel/Frame 050332/0419
Assignment of Assignor's Interest
Recorded: 2019-09-10
Pages: 4
Assignors
HSU, SHAO-EN
Executed: 2019-06-25
CHO, HUEI-SHYONG
Executed: 2019-06-25
LU, SHIH-WEN
Executed: 2019-06-25
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same