Patent Assignment
Reel/Frame 050347/0024
Assignment of Assignor's Interest
Recorded: 2019-09-11
Pages: 4
Assignors
CHEN, CHIH-HAO
Executed: 2019-08-30
PAN, CHIH-CHIEN
Executed: 2019-08-30
CHENG, LI-HUI
Executed: 2019-08-30
KAO, CHIN-FU
Executed: 2019-08-30
LU, SZU-WEI
Executed: 2019-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method for Forming the Same