Patent Assignment
Reel/Frame 050358/0493
Assignment of Assignor's Interest
Recorded: 2019-09-12
Pages: 8
Assignors
HUANG, SIN-YAO
Executed: 2019-08-20
LIN, JENG-SHYAN
Executed: 2019-08-20
CHOU, SHIH-PEI
Executed: 2019-08-26
HSU, TZU-HSUAN
Executed: 2019-08-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Isolation Structure for Bond Pad Structure