Patent Assignment
Reel/Frame 050360/0030
Assignment of Assignor's Interest
Recorded: 2019-09-12
Pages: 8
Assignors
YONEDA, YOSHIHIRO
Executed: 2019-07-31
MATSUSHIMA, TOSHIFUMI
Executed: 2019-07-31
HOSOI, TOSHIHIRO
Executed: 2019-07-31
FUKUDA, KENSHIRO
Executed: 2019-08-07
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper Clad Laminate Sheet, Capacitor Element and Printed Wiring Board with Built-in Capacitor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.