Patent Assignment
Reel/Frame 050365/0886
Assignment of Assignor's Interest
Recorded: 2019-09-13
Pages: 13
Assignors
WU, WEI CHUANG
Executed: 2019-08-01
YAUNG, DUN-NIAN
Executed: 2019-08-01
HUNG, FENG-CHI
Executed: 2019-08-01
LIU, JEN-CHENG
Executed: 2019-08-01
SZE, JHY-JYI
Executed: 2019-08-01
CHOU, KENG-YU
Executed: 2019-08-01
CHIANG, YEN-TING
Executed: 2019-08-06
YANG, MING-HSIEN
Executed: 2019-08-01
CHEN, CHUN-YUAN
Executed: 2019-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Composite Bsi Structure and Method of Manufacturing the Same