Patent Assignment
Reel/Frame 050391/0015
Assignment of Assignor's Interest
Recorded: 2019-09-16
Pages: 4
Assignor
JIN, HAN NA
Executed: 2019-08-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having a Connection Structure with Tapering Connection via Layers