Patent Assignment
Reel/Frame 050396/0948
Assignment of Assignor's Interest
Recorded: 2019-09-17
Pages: 4
Assignors
FUJINO, JUNJI
Executed: 2019-07-29
IMOTO, YUJI
Executed: 2019-07-30
OGAWA, SHOHEI
Executed: 2019-07-30
ISHIHARA, MIKIO
Executed: 2019-07-30
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Power Module Having a Hole in a Lead Frame for Improved Adhesion with a Sealing Resin, Electric Power Conversion Device, and Method for Producing Power Module