IP Library › Assignment 050400/0651
Patent Assignment
Reel/Frame 050400/0651

Assignment of Assignor's Interest

Recorded: 2019-09-17 Pages: 3
Assignors
OH, MYONG SOO
Executed: 2019-09-02
PARK, DOO SAN
Executed: 2019-09-02
JIN, HYUN CHUL
Executed: 2019-09-02
SHIN, HEE JONG
Executed: 2019-09-02
Assignee
SAMSUNG DISPLAY CO. LTD.
1, SAMSUNG RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Bonding Apparatus and Bonding Method
Application: 16/573,086 →
Publication: US 2020/0144221
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee's Name (Missingcomma) Previously Recorded on Reel 050400 Frame 0651. Assignor(S) Hereby Confirms the Samsung Display Co.,Ltd.. Oct 7, 2019
From: OH, MYONG SOO; PARK, DOO SAN; JIN, HYUN CHUL; SHIN, HEE JONG
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 052002/0670 →