Patent Assignment
Reel/Frame 050405/0224
Assignment of Assignor's Interest
Recorded: 2019-09-17
Pages: 6
Assignors
LEE, KANG-WON
Executed: 2019-06-12
SONG, JAEYOUNG
Executed: 2019-06-12
LEE, DONG-SIK
Executed: 2019-06-12
JANG, DONGHOON
Executed: 2019-06-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Devices