Patent Assignment
Reel/Frame 050424/0844
Assignment of Assignor's Interest
Recorded: 2019-09-19
Pages: 6
Assignors
TSAI, CHUNG-HAO
Executed: 2019-08-08
YU, CHEN-HUA
Executed: 2019-08-08
WANG, CHUEI-TANG
Executed: 2019-08-08
CHEN, WEI-TING
Executed: 2019-08-08
CHEN, CHIEN-HSUN
Executed: 2019-08-16
HUANG, SHIH-YA
Executed: 2019-08-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof