Patent Assignment
Reel/Frame 050430/0393
Assignment of Assignor's Interest
Recorded: 2019-09-19
Pages: 4
Assignors
YUN, HYELIM
Executed: 2019-09-17
MIN, BONGKYU
Executed: 2019-09-17
KIM, DOHOON
Executed: 2019-09-17
KIM, TAEWOO
Executed: 2019-09-17
PARK, JINYONG
Executed: 2019-09-17
BANG, JUNGJE
Executed: 2019-09-17
LEE, HYEONGJU
Executed: 2019-09-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Comprising Interposer Surrounding Circuit Elements Disposed on Printed Circuit Board