Patent Assignment
Reel/Frame 050439/0135
Assignment of Assignor's Interest
Recorded: 2019-09-20
Pages: 5
Assignors
CHO, HUNG-CHUN
Executed: 2019-08-13
KUO, HUNG-JUI
Executed: 2019-08-13
HU, YU-HSIANG
Executed: 2019-08-13
LIAO, SIH-HAO
Executed: 2019-08-13
CHEN, WEI-CHIH
Executed: 2019-08-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same