Patent Assignment
Reel/Frame 050439/0157
Assignment of Assignor's Interest
Recorded: 2019-09-20
Pages: 4
Assignors
HU, CHIH-CHIA
Executed: 2019-08-20
CHEN, HSIEN-WEI
Executed: 2019-08-20
CHEN, MING-FA
Executed: 2019-08-20
JAN, SEN-BOR
Executed: 2019-08-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof