Patent Assignment
Reel/Frame 050450/0027
Assignment of Assignor's Interest
Recorded: 2019-09-20
Pages: 3
Assignors
HWANG, JAMES JENG-JYI
Executed: 2019-07-31
WU, JIANN LIH
Executed: 2019-07-31
PENG, HE HUI
Executed: 2019-07-31
YANG, CHI-MING
Executed: 2019-07-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Apparatus and Methods for Chemical Mechanical Polishing