Patent Assignment
Reel/Frame 050468/0607
Assignment of Assignor's Interest
Recorded: 2019-09-24
Pages: 3
Assignors
SON, KWONHO
Executed: 2019-08-19
MOON, HEECHEUL
Executed: 2019-08-19
SEOK, SANGYOUP
Executed: 2019-08-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Dissipation Structure for Electronic Device Including Antenna Module