Patent Assignment
Reel/Frame 050468/0634
Assignment of Assignor's Interest
Recorded: 2019-09-24
Pages: 4
Assignor
SEO, HYEOUNG-WON
Executed: 2019-04-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same