Patent Assignment
Reel/Frame 050468/0645
Assignment of Assignor's Interest
Recorded: 2019-09-24
Pages: 7
Assignors
LEE, JANG-WOO
Executed: 2019-04-22
OH, KYUNG-SUK
Executed: 2019-04-22
KONG, YUNG-CHEOL
Executed: 2019-04-22
PARK, WOO-HYUN
Executed: 2019-07-02
SHIM, JONG-BO
Executed: 2019-04-22
CHA, JAE-MYEONG
Executed: 2019-04-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same