Patent Assignment
Reel/Frame 050483/0949
Assignment of Assignor's Interest
Recorded: 2019-09-25
Pages: 3
Assignee
CHIPBOND TECHNOLOGY CORPORATION
NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Surface Acoustic Wave Device and Method of Manufacturing the Same