Patent Assignment
Reel/Frame 050485/0502
Assignment of Assignor's Interest
Recorded: 2019-09-25
Pages: 6
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bond Pad Structure with Reduced Step Height and Increased Electrical Isolation