Patent Assignment
Reel/Frame 050488/0228
Assignment of Assignor's Interest
Recorded: 2019-09-25
Pages: 6
Assignors
YI, HONGSHENG
Executed: 2019-09-19
YE, GUOLIANG
Executed: 2019-09-19
WANG, JIAQI
Executed: 2019-09-19
Assignee
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 18, GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, WUHAN, HUBEI, 430205, CHINA
Covered Property
(1)
Chip Interconnection Structure, Wafer Interconnection Structure and Method for Manufacturing the Same