Patent Assignment
Reel/Frame 050489/0303
Assignment of Assignor's Interest
Recorded: 2019-09-25
Pages: 4
Assignee
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 18, GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, WUHAN, HUBEI, 430205, CHINA
Covered Property
(1)
Wafer Structure with Capacitive Chip Interconnection, Method for Manufacturing the Same, and Chip Structure with Capacitive Chip Interconnection