Patent Assignment
Reel/Frame 050500/0784
Assignment of Assignor's Interest
Recorded: 2019-09-26
Pages: 8
Assignors
JEONG, JIN SUK
Executed: 2016-07-21
SEONG, KYEONG SOOL
Executed: 2016-07-21
KIM, KYE RYUNG
Executed: 2016-07-21
KWON, YOUNG IK
Executed: 2016-07-21
SIM, KI DONG
Executed: 2019-07-21
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Method of Forming a Semiconductor Device Including Forming an Emi Shielding Layer Over the Semiconductor Device Attached to a Tape via Adhesive
Application:
16/583,632 →
Publication:
US 2020/0126929
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Correct Execution Date Previously Recorded at Reel: 050500 Frame: 0784. Assignor(S) Hereby Confirms the Assignment.
Oct 16, 2019
From: JEONG, JIN SUK; SEONG, KYEONG SOOL; KIM, KYE RYUNG; KWON, YOUNG IK
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 050740/0545 →
Assignment of Assignor's Interest
Nov 24, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 054514/0218 →