IP Library Assignment 054514/0218
Patent Assignment
Reel/Frame 054514/0218

Assignment of Assignor's Interest

Recorded: 2020-11-24 Pages: 44
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2019-11-19
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491 B RIVER VALLEY ROAD, VALLEY POINT #12/03, SINGAPORE, 248373, SINGAPORE
Covered Properties (13)
Semiconductor Device and Manufacturing Method Thereof
Application: 16/456,884 →
Publication: US 2019/0326206
Semiconductor Device with Integrated Heat Distribution and Manufacturing Method Thereof
Application: 16/564,814 →
Publication: US 2020/0006300
Method of Forming a Semiconductor Device Including Forming an Emi Shielding Layer Over the Semiconductor Device Attached to a Tape via Adhesive
Application: 16/583,632 →
Publication: US 2020/0126929
Semiconductor Package Structure for Improving Die Warpage and Manufacturing Method Thereof
Application: 16/707,411 →
Publication: US 2020/0185338
Semiconductor Package With EMI Shield and Fabricating Method Thereof
Application: 16/777,519 →
Publication: US 2020/0243459
Semiconductor Device with Tiered Pillar and Manufacturing Method Thereof
Application: 16/887,590 →
Publication: US 2020/0294815
Semiconductor Package Using Cavity Substrate and Manufacturing Methods
Application: 16/889,971 →
Publication: US 2020/0303315
Semiconductor Device with Redistribution Layers on Partial Encapsulation and Non-Photosensitive Passivation Layers
Application: 16/890,624 →
Publication: US 2020/0365504
Semiconductor Device with Redistribution Layers Formed Utilizing Dummy Substrates
Application: 16/921,522 →
Publication: US 2020/0335461
Semiconductor Device Package and Manufacturing Method Thereof
Application: 16/925,546 →
Publication: US 2020/0343129
Method and System for Packing Optimization of Semiconductor Devices
Application: 16/943,015 →
Publication: US 2020/0357763
Semiconductor Device with Transmissive Layer and Manufacturing Method Thereof
Application: 17/026,752 →
Publication: US 2021/0020813
Wafer-Level Stack Chip Package and Method of Manufacturing the Same
Application: 17/028,329 →
Publication: US 2021/0020535
Related Assignments (16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 9, 2019
From: BANG, WON BAE; OH, KWANG SEOK
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 049706/0685 →
Assignment of Assignor's Interest Sep 10, 2019
From: BALOGLU, BORA; HUEMOELLER, RON; ZWENGER, CURTIS
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 050326/0687 →
Assignment of Assignor's Interest Sep 26, 2019
From: JEONG, JIN SUK; SEONG, KYEONG SOOL; KIM, KYE RYUNG; KWON, YOUNG IK
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 050500/0784 →
Corrective Assignment to Correct the Correct Execution Date Previously Recorded at Reel: 050500 Frame: 0784. Assignor(S) Hereby Confirms the Assignment. Oct 16, 2019
From: JEONG, JIN SUK; SEONG, KYEONG SOOL; KIM, KYE RYUNG; KWON, YOUNG IK
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 050740/0545 →
Assignment of Assignor's Interest Dec 10, 2019
From: KIM, JIN SEONG; CHO, BYONG WOO; SONG, CHA GYU
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 051233/0757 →
Assignment of Assignor's Interest Feb 4, 2020
From: SHIN, DOO SOUB; LEE, TAE YONG; LEE, KYOUNG YEON; KIM, SUNG GYU
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 051708/0310 →
Assignment of Assignor's Interest Jun 2, 2020
From: HUEMOELLER, RONALD PATRICK; KELLY, MICHAEL G.; ZWENGER, CURTIS
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 052808/0502 →
Assignment of Assignor's Interest Jun 2, 2020
From: PAEK, JONG SIK; KIM, JIN YOUNG; KIM, JIN HAN; CHA, SE WOONG
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 052818/0159 →
Assignment of Assignor's Interest Jun 2, 2020
From: KWEON, YOUNG DO; CHAE, JEONGBYUNG; PARK, DONGJOO; CHO, BYOUNGWOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 052807/0990 →
Assignment of Assignor's Interest Jul 7, 2020
From: KIM, JIN YOUNG; CHUNG, JI YOUNG; PARK, DOO HYUN; LEE, CHOON HEUNG
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 053135/0582 →
Assignment of Assignor's Interest Jul 13, 2020
From: KELLY, MICHAEL G.; HUEMOELLER, RONALD PATRICK; HINER, DAVID JON; DO, WON CHUL
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 053190/0001 →
Assignment of Assignor's Interest Jul 30, 2020
From: RINNE, GLENN; RICHTER, DANIEL
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 053353/0615 →
Assignment of Assignor's Interest Sep 22, 2020
From: KO, YEONG BEOM; KIM, DONG JIN; CHA, SE WOONG
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 053847/0910 →
Assignment of Assignor's Interest Oct 15, 2020
From: CLARK, DAVID; ZWENGER, CURTIS
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 054060/0492 →
Assignment of Assignor's Interest Apr 11, 2023
From: KIM, YOONJOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063288/0670 →
Assignment of Assignor's Interest Apr 12, 2023
From: LEE, SEUNGJAE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063299/0856 →