Patent Assignment
Reel/Frame 052818/0159
Assignment of Assignor's Interest
Recorded: 2020-06-02
Pages: 14
Assignors
PAEK, JONG SIK
Executed: 2014-07-24
KIM, JIN YOUNG
Executed: 2014-07-24
KIM, JIN HAN
Executed: 2014-07-30
CHA, SE WOONG
Executed: 2014-07-24
BAE, JAE HUN
Executed: 2014-07-30
KIM, DONG JIN
Executed: 2014-07-28
PARK, DOO HYUN
Executed: 2014-07-24
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Device with Redistribution Layers on Partial Encapsulation and Non-Photosensitive Passivation Layers
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 24, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 054514/0218 →
Assignment of Assignor's Interest
Apr 11, 2023
From: KIM, YOONJOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063288/0670 →
Assignment of Assignor's Interest
Apr 12, 2023
From: LEE, SEUNGJAE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063299/0856 →