IP Library › Assignment 051233/0757
Patent Assignment
Reel/Frame 051233/0757

Assignment of Assignor's Interest

Recorded: 2019-12-10 Pages: 7
Assignors
KIM, JIN SEONG
Executed: 2014-07-30
CHO, BYONG WOO
Executed: 2014-07-30
SONG, CHA GYU
Executed: 2014-07-30
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package Structure for Improving Die Warpage and Manufacturing Method Thereof
Application: 16/707,411 →
Publication: US 2020/0185338
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 24, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 054514/0218 →