IP Library › Assignment 050326/0687
Patent Assignment
Reel/Frame 050326/0687

Assignment of Assignor's Interest

Recorded: 2019-09-10 Pages: 6
Assignors
BALOGLU, BORA
Executed: 2017-12-19
HUEMOELLER, RON
Executed: 2017-12-19
ZWENGER, CURTIS
Executed: 2017-12-19
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Device with Integrated Heat Distribution and Manufacturing Method Thereof
Application: 16/564,814 →
Publication: US 2020/0006300
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 24, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 054514/0218 →