Patent Assignment
Reel/Frame 051708/0310
Assignment of Assignor's Interest
Recorded: 2020-02-04
Pages: 7
Assignors
SHIN, DOO SOUB
Executed: 2017-01-13
LEE, TAE YONG
Executed: 2017-01-13
LEE, KYOUNG YEON
Executed: 2017-01-13
KIM, SUNG GYU
Executed: 2017-01-13
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package With EMI Shield and Fabricating Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.