IP Library › Assignment 050504/0115
Patent Assignment
Reel/Frame 050504/0115

Assignment of Assignor's Interest

Recorded: 2019-09-26 Pages: 8
Assignors
BHAT, JEROME CHANDRA
Executed: 2019-04-04
CHENG, JIM CHIH-MIN
Executed: 2019-04-04
OLSEN, RICHARD IAN
Executed: 2019-09-24
Assignee
INSYTE SYSTEMS, INC.
39655 EUREKA DR., NEWARK, CALIFORNIA, 94560
Covered Properties (3)
Chip-Scale Sensing Device for Low Density Material
Application: 16/254,241 →
Publication: US 2019/0227024
Chip-scale sensing device for low density material
Application: 62/620,372 →
Low Impedance Sensor for Low Density Material
Application: 62/620,963 →
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 2, 2023
From: INSYTE SYSTEMS, INC.
To: INSYTE ABC, LLC
Reel/Frame 064472/0672 →
Assignment of Assignor's Interest Aug 2, 2023
From: INSYTE ABC, LLC
To: QUALCOMM TECHNOLOGIES, INC.
Reel/Frame 064472/0790 →
Assignment of Assignor's Interest Jan 3, 2025
From: QUALCOMM TECHNOLOGIES, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 069853/0097 →