Patent Assignment
Reel/Frame 050506/0807
Assignment of Assignor's Interest
Recorded: 2019-09-26
Pages: 3
Assignor
VASOYA, KALU K.
Executed: 2015-04-10
Assignee
SINKPAD, LLC
1907 NANCITA CIRCLE, PLACENTIA, CALIFORNIA, 92870
Covered Property
(1)
Printed Circuit Board That Provides a Direct Thermal Path Between Components and a Thermal Layer and Method for Assembly
Patent:
10,531,556 →
Application:
15/882,895 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 27, 2019
From: SINKPAD, LLC
To: ADURA LED SOLUTIONS, LLC
Reel/Frame 050580/0741 →
Security Interest
Apr 17, 2023
From: ADURA, LLC
To: ZIONS BANCORPORATION, N.A. DBA CALIFORNIA BANK & TRUST
Reel/Frame 063347/0629 →
Change of Name
Apr 17, 2023
From: ADURA LED SOLUTIONS, LLC
To: ADURA, LLC
Reel/Frame 063348/0957 →