IP Library › Assignment 050514/0587
Patent Assignment
Reel/Frame 050514/0587

Assignment of Assignor's Interest

Recorded: 2019-09-27 Pages: 9
Assignors
INOUE, SAORI
Executed: 2019-05-13
YAMAGATA, TOSHITAKA
Executed: 2019-05-08
MINAKATA, YOSHITAKA
Executed: 2019-05-17
YOSHIMATSU, RYO
Executed: 2019-05-09
KOGA, RYUJI
Executed: 2019-08-13
Assignee
DENKA COMPANY LIMITED
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, 1038338, JAPAN
Covered Property (1)
Thermal Conductive Member and Heat Dissipation Structure Including the Same
Application: 16/498,648 →
Publication: US 2020/0031723