Patent Assignment
Reel/Frame 050514/0650
Assignment of Assignor's Interest
Recorded: 2019-09-27
Pages: 4
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG RD., TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Electronic Packaging Structure and Method for Manufacturing the Electronic Packaging Structure with Optical Guide Die Separate from Electronic Package and Photonic Die