Patent Assignment
Reel/Frame 050514/0756
Assignment of Assignor's Interest
Recorded: 2019-09-27
Pages: 7
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1- 525, BOISE, IDAHO, 83716
Covered Property
(1)
Integrated Assemblies Comprising Conductive Levels Having Two Different Metal-Containing Structures Laterally Adjacent One Another, and Methods of Forming Integrated Assemblies