Patent Assignment
Reel/Frame 050527/0787
Assignment of Assignor's Interest
Recorded: 2019-09-27
Pages: 6
Assignors
JUNG, YANGGYOO
Executed: 2019-08-07
KIM, CHULWOO
Executed: 2019-08-07
RYU, HYO-CHANG
Executed: 2019-08-07
CHOI, YUN SEOK
Executed: 2019-08-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Substrate Having Two Silicon Layers Formed on Each Other