Patent Assignment
Reel/Frame 050569/0635
Assignment of Assignor's Interest
Recorded: 2019-09-30
Pages: 7
Assignors
CHO, BONGJU
Executed: 2019-09-23
KANG, MYUNGSAM
Executed: 2019-09-23
KO, YOUNGGWAN
Executed: 2019-09-23
LEE, GUN
Executed: 2019-09-23
LEE, JAEKUL
Executed: 2019-09-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package