Patent Assignment
Reel/Frame 050570/0316
Assignment of Assignor's Interest
Recorded: 2019-09-30
Pages: 6
Assignee
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Semiconductor Device Including Semiconductor Chip Having Elongated Bumps